People

Postdoc Researchers

1. Yuyao Kong (2023 fall-present)  LinkedIn   Email
Ph.D. electrical engineering, Southeast University, China
Research Topic: Chip design for in-memory computing

PhD Students

1. Chinsung Park (2021 spring-present, co-advised by Prof. Asif Khan)  LinkedIn  Email
M.S. materials science and engineering, University of Florida, USA, and SK Hynix Engineer, South Korea
Research Topic: Ferroelectric transistor process integration

2. Po-Kai Hsu (2021 fall-present)  LinkedIn  Email
M.S. electrical engineering, National Tsing Hua University, and Macronix Engineer, Taiwan
Research Topic: 3D NAND/3D DRAM based hardware accelerator for ultra-large AI model 

  • Best demo at SRC PRISM Center Review, 2023
  • Intern at Intel (Hillsboro, OR), 2024 summer
  • Taiwanese Government Scholarships to Study Abroad (GSSA), 2024

3. Janak Sharda (2021 fall-present)  LinkedIn  Email
B.S. electrical engineering, Indian Institute of Technology, Delhi, India
Research Topic: In-pixel compute and heterogeneous integration design

  • Intern at Intel (Chandler, AZ), 2024 summer

4. Jungyoun Kwak (2021 fall-present)  LinkedIn  Email
B.S. electrical engineering, UC Berkeley,  USA and Samsung Engineer, South Korea
Research Topic: M3D integration and BEOL power delivery design

  • IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) Best Paper Award 2023
  • IEEE International Symposium on Circuits and Systems (ISCAS) PhD Forum 2024
  • IEEE Circuits and Systems Society (CASS) Pre-Doctoral Grant, 2024

5. James Read (2021 fall-present) LinkedIn  Email
B.S. electrical engineering, University of Michigan, USA
Research Topic: Deep learning algorithm and hardware co-design

  • Intern at Rain Neuromorphic (remote), 2024 summer
  • Design Automation Conference (DAC) Young Fellow, 2023
  • DOD SCALE Fellow

6. Vaidehi Garg (2022 summer-present)  LinkedIn  Email
B.S. electrical engineering, Cornell University, USA
Research Topic: Chip design and tape-out for in-memory computing

  • Design Automation Conference (DAC) Young Fellow, 2024

7. Omkar Phadke (2022 fall-present)  LinkedIn  Email
M.E. electrical engineering, Indian Institute of Technology, Bombay, India
Research Topic: Ferro and BEOL device characterization and modeling

8. Junmo Lee (2022 fall-present)  LinkedIn  Email
B.S. electrical engineering, Seoul National University, South Korea
Research Topic: Technological benchmark and device fab for BEOL power delivery

9. Wei-Hsing Huang (2023 fall-present) LinkedIn  Email
M.S. electrical engineering, National Tsing Hua University and MediaTek engineer, Taiwan
Research Topic: Software-hardware co-design for in-pixel compute and emerging AI model

10. Jianwei Jia (2023 fall-present) LinkedIn  Email 
M.S. electrical engineering, University of Michigan, USA
Research Topic: Chip design and tape-out for in-memory computing

11. Minji Shon (2023 fall-present) LinkedIn  Email 
B.S. electrical engineering, Sogang University, and Samsung engineer, South Korea
Research Topic: ML-assisted device modeling and reliability-aware design

12. Faaiq Waqar (2023 fall-present)  LinkedIn  Email 
B.S. electrical engineering and computer science, Oregon State University, and Microsoft engineer, USA
Research Topic: Technological benchmark and software-hardware co-design

  • NSF Graduate Research Fellowship 

13. Madhav Vadlamani (2023 fall-present) LinkedIn  Email  
B.S. electrical engineering, Indian Institute of Technology Bombay, India
Research Topic: Physical stochastic computing and cryogenic computing

14. Stuart Wodzro (2023 fall-present) LinkedIn Email  
B.E. electrical engineering, Vanderbilt University, USA
Research Topic: Memory device modeling and radiation effects

  • GEM Fellowship
  • DOD SCALE Fellow
  • 3rd place in Poster at Purdue CSME Annual Review 2024

15. Seongkwang Lim (2024 fall-present) Email  

B.S. electrical engineering, Yosei University, and Samsung engineer, South Korea
Research Topic: DTCO for emerging transistors and memory devices

16. Sungwon Cho (2024 fall-present) LinkedIn Email  

B.S. electrical engineering, Seoul National University, and Samsung engineer, South Korea
Research Topic: 3D DRAM physical design

17. Seongwon Yoon (2024 fall-present) LinkedIn Email  

B.S. electrical engineering, Seoul National University, South Korea
Research Topic: In-pixel compute design 

18. Jay Sonawane (2024 fall-present) LinkedIn Email  

M.E. electrical engineering, Indian Institute of Technology, Bombay, India
Research Topic: Ferro and BEOL device characterization and modeling

19. Haomei Liu (2024 fall-present) LinkedIn Email  

M.S. electrical engineering, University of South California, USA
Research Topic: Chip design and tape-out for in-memory computing

20. Matthew Chen (2024 fall-present) LinkedIn Email  

B.S. electrical engineering, University of Maryland, USA
Research Topic: Chip design and tape-out for in-memory computing

21. Pin-Jun Chen (2024 fall-present) LinkedIn Email  

M.S. electrical engineering, National Chiao-Tung University, Taiwan
Research Topic: Thermal and electrical design for 3D IC

22. Hung-Chun Chou (2024 fall-present) LinkedIn Email  

M.S. electrical engineering, National Taiwan University, Taiwan
Research Topic: Ferro and BEOL device fabrication and characterization

23. Ming-Yen Lee (2024 fall-present) LinkedIn Email  

B.S. electrical engineering, Tsinghua University, China
Research Topic: Software-hardware co-design for emerging AI model

24. Eugene Chu (2024 fall-present) LinkedIn Email  

M.S. electrical engineering, UCLA, USA
Research Topic: Thermal and electrical design for 3D IC

Visiting Scholars

1. Choongki Kim (2023 summer-2024 summer) LinkedIn
SK Hynix Engineer, South Korea

2. Byeongil Han (2022 summer-2023 spring) LinkedIn
SK Hynix Engineer, South Korea

3. Prof. Sangbum Kim (2021 fall-2022 summer) LinkedIn
Dept. of Materials and Science Engineering, Seoul National University, South Korea

Group Alumni 

1. Wantong Li (2019 fall-2024 spring)  LinkedIn 
PhD Thesis: Efficient and Robust Compute-in-Memory for Edge Intelligence
First Employment: Assistant professor, UC Riverside, CA

  • Intern at AMD (Austin, TX), 2023 fall
  • Intern at MediaTek (San Jose, CA), 2022 summer
  • Design, Automation and Test in Europe Conference (DATE) PhD Forum, 2023
  • Design Automation Conference (DAC) PhD Forum, 2023
  • Georgia Tech ECE INSPIRE Fellow, 2023

2. Yuan-chun Luo (2019 fall-2024 spring)  LinkedIn 
PhD Thesis: Design-Technology Co-Optimization of Ferroelectric Devices for Capacitive In-memory Computing and On-Chip Buffers
First Employment: Nvidia (Santa Clara, CA)

  • Colonel Oscar P. Cleaver Award for outstanding Ph.D. dissertation proposal 2022
  • Taiwanese Government Scholarships to Study Abroad (GSSA), 2020
  • Visiting scholar at IMEC (Leuven, Belgium) 2023 fall
  • Intern at Meta/Facebook (Menlo Park, CA), 2022 summer
  • Intern at Qualcomm (San Diego, CA), 2023 summer
  • IEEE Transactions on Nanotechnology (T-NANO) Best Paper Award 2021

3. Anni Lu (2019 fall-2024 spring)  LinkedIn  
PhD Thesis: Algorithm-Hardware Co-Design for Deep Learning and Probabilistic Computing with Compute-In-Memory Accelerators
First Employment: Intel (Hillsboro, OR); Now: Nvidia (Santa Clara, CA)

  • Intern at Intel (Hillsboro, OR), 2023 summer
  • Intern at TSMC (San Jose, CA), 2023 fall
  • Georgia Tech ECE GRA Excellence Award 2023

4. Gihun Choe (2019 fall-2023 fall) LinkedIn 
PhD Thesis: Advanced Modeling Techniques for Ferroelectric Memories from TCAD to Machine Learning
First Employment: Intel (Hillsboro, OR)

  • Intern at Intel (Hillsboro, OR), 2023 summer

5. Yandong Luo, PhD (2018 fall-2022 fall)  LinkedIn
PhD Thesis: Energy Efficient On-chip Deep Neural Network (DNN) Inference and Training with Emerging Nonvolatile Memory Technologies
First Employment: Apple (Cupertino, CA)  

  • Intern at Meta/Facebook (Bellevue, WA), 2022 summer
  • IEEE International Memory Workshop (IMW) Best Student Paper Award 2022

6. Shanshi Huang, PhD (2019 spring-2022 fall)  LinkedIn
PhD Thesis: Reliability and Security of Compute-in-Memory based Deep Neural Network Accelerators
First Employment: Assistant professor, Hong Kong University of Science and Technology (Guangzhou, China)

  • ACM Transactions on Design Automation of Electronic Systems (TODAES) Best Paper Award 2024

7. Hongwu Jiang, PhD (2019 spring-2022 fall)  LinkedIn
PhD Thesis: Architecture and Circuit Design Optimization for Compute-in-Memory
First Employment: Assistant professor, Hong Kong University of Science and Technology (Guangzhou, China)

  • Design Automation Conference (DAC) PhD Forum, 2020
  • Intern at IMEC (remote), 2021 summer

8. Panni Wang, PhD (2017 fall-2021 spring)  LinkedIn
PhD Thesis: Investigating Ferroelectric and Metal-Insulator Phase Transition Devices for Neuromorphic Computing
First Employment: Western Digital (Milpitas, CA); Now: Nvidia (Santa Clara, CA)

  • Colonel Oscar P. Cleaver Award for outstanding Ph.D. dissertation proposal 2020
  • Georgia Tech Sigma Xi Best Ph.D. Thesis Award 2021

9. Xiaochen Peng, PhD (2017 spring-2021 spring)  LinkedIn
PhD Thesis: Benchmark Framework for 2-D/3-D Integrated Compute-in-Memory based Machine Learning Accelerator
First Employment: TSMC (San Jose, CA)

  • IEEE Transactions on Computer-Aided Design (TCAD) Donald O. Pederson Best Paper Award 2023
  • European Design and Automation Association (EDAA) Outstanding Dissertation Award 2023
  • Intern at TSMC (San Jose, CA), 2021 spring
  • Design Automation Conference (DAC) PhD Forum, 2019

10. Xiaoyu Sun, PhD (2016 spring-2020 summer)  LinkedIn
PhD Thesis: Compute-in-Memory with Emerging Non-Volatile Memories for Accelerating Deep Neural Networks
First Employment: TSMC (San Jose, CA)

  • Intern at TSMC (San Jose, CA), 2020 spring
  • SRC TECHCON Student Presentation Award, 2019

11. Rui Liu, PhD (2014 fall-2018 fall)  LinkedIn
PhD Thesis: Semiconductor Memory Applications in Radiation Environment, Hardware Security and Machine Learning System
First Employment: Synopsys (Mountain View, CA)

  • Intern at HP Labs (Palo Alto, CA), 2018 summer
  • Design Automation Conference (DAC) PhD Forum, 2018

12. Pai-Yu Chen, PhD (2013 fall-2018 spring)  LinkedIn
PhD Thesis: Design of Resistive Synaptic Devices and Array Architectures for Neuromorphic Computing
First Employment: Synopsys (Mountain View, CA); Now: AMD (Santa Clara, CA)

  • Taiwanese Government Scholarships to Study Abroad (GSSA), 2015
  • Intern at IMEC (Leuven, Belgium), 2016 summer
  • Design Automation Conference (DAC) PhD Forum, 2017

1. Tae-Hyeon Kim, Postdoc (2023 spring-2024 spring)  LinkedIn  
Research Topic: Ferro device fabrication and BEOL integration on top of CMOS
First employment: Assistant professor, Seoul National University of Science and Technology, South Korea

2. Sola Woo, Postdoc (2022 fall-2023 spring)  LinkedIn  
Research Topic: TCAD modeling and simulation of advanced memory devices
First employment: Assistant professor, Pukyung National University, South Korea

3. Jae Hur, Postdoc (2019 spring-2022 summer)  LinkedIn
Research Topic: Ferro device fabrication and modeling
First employment: Intel (Hillsboro, OR)

4. Sung-Tae Lee, Postdoc (2021 fall-2022 spring)   LinkedIn
Research Topic: Ferro device fabrication and modeling
First employment: Assistant professor, Hongik University, South Korea

5. Wonbo Shim, Postdoc (2019 summer-2021 summer)  LinkedIn
Research Topic: NVM chip testing and NAND based deep learning architecture design
First employment: Assistant professor, Seoul National University of Science and Technology, South Korea

6. Jiyong Woo, Postdoc (2017 fall-2019 spring)  LinkedIn
Research Topic: Resistive device fabrication and circuit-device interaction
First employment: Electronics and Telecommunications Research Institute (ETRI) of South Korea; (Now) Assistant professor, Kyungpook National University, South Korea

7. Ligang Gao, Postdoc (2014 fall-2017 summer)  LinkedIn
Research Topic: Resistive device optimization and crossbar array fabrication
First Employment: Solar Junction (Tempe, AZ); (Now) Lam Research (Chandler, AZ)


1. Jack Sacane, MS (2020 fall-2021 spring)  LinkedIn
MS Thesis: Total Ionizing Dose Effect on Deep Neural Networks Implemented with Multi-Level RRAM Arrays
First Employment: Millennium Space Systems (Los Angeles, CA)

2. Sho Ko, MS (2019 fall-2020 spring)  LinkedIn
MS Thesis: Efficient Pipelined ReRAM-based Processing-in-Memory Architecture for Convolutional Neural Network Inference
First Employment: Continue PhD study at Stanford University

Undergraduate Students

1. Yiming Tan (2022 fall-2024 spring)

  • Best undergraduate demo at SRC PRISM Center Review, 2023

2. Gyujun Jeong, exchange student from KAIST (2024 spring-2024 summer)

3. Zhuoqi Cai, DOD SCALE fellow (2023 fall)

4. Paul Park, DOD SCALE fellow (2023 fall)

5. Alex Schroeder, DOD SCALE fellow (2023 fall)

6. Ethan Weinstock, DOD SCALE fellow (2021 fall-2023 spring)

  • Eta Kappa Nu (HKN) Society Outstanding Computer Engineering Senior Award 2023
  • Opportunity Research Scholars’ Symposium Best Paper Award 2023

7. Laura Heller (2019 fall-2020 spring)

8. Jenna Moore, NSF REU and Honor’s thesis (2016 summer-2017 spring)

9. Ryan Madler, NSF REU and Honor’s thesis (2015 fall-2016 spring)

10. Scott Zuloaga (2014 summer-2015 spring)