Postdoc Researchers
1. Tae-Hyeon Kim (2023 spring-present) LinkedIn Email
Ph.D. electrical engineering, Seoul National University, South Korea
Research Topic: Ferro device fabrication and BEOL integration on top of CMOS
PhD Students
1. Wantong Li (2019 fall-present) LinkedIn Email
M.S. electrical engineering, Columbia University, USA
Research Topic: AI hardware design and chip tape-out
- Intern at MediaTek (San Jose, CA), 2022 summer
- Design, Automation and Test in Europe Conference (DATE) PhD Forum, 2023
- Design Automation Conference (DAC) PhD Forum, 2023
- Georgia Tech ECE INSPIRE Fellow, 2023
2. Gihun Choe (2019 fall-present) LinkedIn Email
M.S. electrical engineering, University of Seoul, South Korea
Research Topic: Ferro device characterization and ML assisted modeling
- Intern at Intel (Hillsboro, OR), 2023 summer
3. Yuan-chun Luo (2019 fall-present) LinkedIn Email
B.S. electrical engineering, National Tsing-Hua University, Taiwan
Research Topic: Ferro device modeling and circuit-device interaction
- Colonel Oscar P. Cleaver Award for outstanding Ph.D. dissertation proposal 2022
- Taiwanese Government Scholarships to Study Abroad (GSSA), 2020
- Visiting scholar at IMEC (Leuven, Belgium) 2023 fall
- Intern at Meta/Facebook (Menlo Park, CA), 2022 summer
- Intern at Qualcomm (San Diego, CA), 2023 summer
- IEEE Transactions on Nanotechnology (T-NANO) Best Paper Award 2021
4. Anni Lu (2019 fall-present) LinkedIn Email
B.S. electrical engineering, Tianjin University, China
Research Topic: Deep learning and probabilistic computing algorithm and hardware co-design
- Intern at Intel (Hillsboro, OR), 2023 summer
- Intern at TSMC (San Jose, CA), 2023 fall
- Georgia Tech ECE GRA Excellence Award 2023
5. Chinsung Park (2021 spring-present, co-advised by Prof. Asif Khan) LinkedIn Email
M.S. materials science and engineering, University of Florida, USA, and SK Hynix Engineer, South Korea
Research Topic: Ferroelectric transistor process integration
6. Po-Kai Hsu (2021 fall-present) LinkedIn Email
M.S. electrical engineering, National Tsing Hua University, and Macronix Engineer, Taiwan
Research Topic: 3D NAND based hardware accelerator for ultra-large AI model
7. Janak Sharda (2021 fall-present) LinkedIn Email
B.S. electrical engineering, Indian Institute of Technology, Delhi, India
Research Topic: In-pixel compute and heterogeneous integration design
8. Jungyoun Kwak (2021 fall-present) LinkedIn Email
B.S. electrical engineering, UC Berkeley, USA and Samsung Engineer, South Korea
Research Topic: 3D integration and BEOL power delivery design
- IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) Best Paper Award 2023.
9. James Read (2021 fall-present) LinkedIn Email
B.S. electrical engineering, University of Michigan, USA
Research Topic: Deep learning algorithm and hardware co-design
- Design Automation Conference (DAC) Young Fellow, 2023
- DOD SCALE Fellow
10. Vaidehi Garg (2022 summer-present) LinkedIn Email
B.S. electrical engineering, Cornell University, USA
Research Topic: Chip design and tape-out for in-memory computing
11. Omkar Phadke (2022 fall-present) LinkedIn Email
M.S. electrical engineering, Indian Institute of Technology, Bombay, India
Research Topic: Ferro and BEOL device characterization and modeling
12. Junmo Lee (2022 fall-present) LinkedIn Email
B.S. electrical engineering, Seoul National University, South Korea
Research Topic: Technological benchmark and device fab for BEOL power delivery
13. Wei-Hsing Huang (2023 fall-present) LinkedIn Email
M.S. electrical engineering, National Tsing Hua University and MediaTek engineer, Taiwan
Research Topic: Software-hardware co-design for in-pixel compute and large AI model
14. Jianwei Jia (2023 fall-present) LinkedIn Email
M.S. electrical engineering, University of Michigan, USA
Research Topic: Chip design and tape-out for in-memory computing
15. Minji Shon (2023 fall-present) LinkedIn Email
B.S. electrical engineering, Sogang University, and Samsung engineer, South Korea
Research Topic: ML-assisted device modeling and 3D integration design
16. Faaiq Waqar (2023 fall-present) LinkedIn Email
B.S. electrical engineering and computer science, Oregon State University, and Microsoft engineer, USA
Research Topic: Technological benchmark and 3D integration design
17. Madhav Vadlamani (2023 fall-present) LinkedIn Email
B.S. electrical engineering, Indian Institute of Technology Bombay, India
Research Topic: Physical stochastic computing and cryogenic computing
MS Students
1. Xiaoqiao (Joyce) Hu (2023 fall-present) LinkedIn Email
B.S. electrical engineering, University of Illinois Urbana-Champaign (UIUC), and Intel engineer, USA
Research Topic: BEOL power delivery design and security analysis
- DOD SCALE Fellow
Visiting Scholars
1. Choongki Kim (2023 summer-present) LinkedIn
SK Hynix Engineer, South Korea
2. Byeongil Han (2022 summer-2023 spring) LinkedIn
SK Hynix Engineer, South Korea
2. Prof. Sangbum Kim (2021 fall-2022 summer) LinkedIn
Dept. of Materials and Science Engineering, Seoul National University, South Korea
Group Alumni
1. Yandong Luo, PhD (2018 fall-2022 fall) LinkedIn
PhD Thesis: Energy Efficient On-chip Deep Neural Network (DNN) Inference and Training with Emerging Nonvolatile Memory Technologies
First Employment: Apple (Cupertino, CA)
- Intern at Meta/Facebook (Bellevue, WA), 2022 summer
- IEEE International Memory Workshop (IMW) Best Student Paper Award 2022
2. Shanshi Huang, PhD (2019 spring-2022 fall) LinkedIn
PhD Thesis: Reliability and Security of Compute-in-Memory based Deep Neural Network Accelerators
First Employment: Assistant professor, Hong Kong University of Science and Technology (Guangzhou, China)
3. Hongwu Jiang, PhD (2019 spring-2022 fall) LinkedIn
PhD Thesis: Architecture and Circuit Design Optimization for Compute-in-Memory
First Employment: Assistant professor, Hong Kong University of Science and Technology (Guangzhou, China)
- Design Automation Conference (DAC) PhD Forum, 2020
- Intern at IMEC (remote), 2021 summer
4. Panni Wang, PhD (2017 fall-2021 spring) LinkedIn
PhD Thesis: Investigating Ferroelectric and Metal-Insulator Phase Transition Devices for Neuromorphic Computing
First Employment: Western Digital (Milpitas, CA)
- Colonel Oscar P. Cleaver Award for outstanding Ph.D. dissertation proposal 2020
- Georgia Tech Sigma Xi Best Ph.D. Thesis Award 2021
5. Xiaochen Peng, PhD (2017 spring-2021 spring) LinkedIn
PhD Thesis: Benchmark Framework for 2-D/3-D Integrated Compute-in-Memory based Machine Learning Accelerator
First Employment: TSMC (San Jose, CA)
- IEEE Transactions on Computer-Aided Design (TCAD) Donald O. Pederson Best Paper Award 2023
- European Design and Automation Association (EDAA) Outstanding Dissertation Award 2023
- Intern at TSMC (San Jose, CA), 2021 spring
- Design Automation Conference (DAC) PhD Forum, 2019
6. Xiaoyu Sun, PhD (2016 spring-2020 summer) LinkedIn
PhD Thesis: Compute-in-Memory with Emerging Non-Volatile Memories for Accelerating Deep Neural Networks
First Employment: TSMC (San Jose, CA)
- Intern at TSMC (San Jose, CA), 2020 spring
- SRC TECHCON Student Presentation Award, 2019
7. Rui Liu, PhD (2014 fall-2018 fall) LinkedIn
PhD Thesis: Semiconductor Memory Applications in Radiation Environment, Hardware Security and Machine Learning System
First Employment: Synopsys (Mountain View, CA)
- Intern at HP Labs (Palo Alto, CA), 2018 summer
- Design Automation Conference (DAC) PhD Forum, 2018
8. Pai-Yu Chen, PhD (2013 fall-2018 spring) LinkedIn
PhD Thesis: Design of Resistive Synaptic Devices and Array Architectures for Neuromorphic Computing
First Employment: Synopsys (Mountain View, CA); Now: AMD (Santa Clara, CA)
- Taiwanese Government Scholarships to Study Abroad (GSSA), 2015
- Intern at IMEC (Leuven, Belgium), 2016 summer
- Design Automation Conference (DAC) PhD Forum, 2017
1. Sola Woo, Postdoc (2022 fall-2023 spring) LinkedIn
Research Topic: TCAD modeling and simulation of advanced memory devices
First employment: Assistant professor, Pukyung National University, South Korea
2. Jae Hur, Postdoc (2019 spring-2022 summer) LinkedIn
Research Topic: Ferro device fabrication and modeling
First employment: Intel (Hillsboro, OR)
3. Sung-Tae Lee, Postdoc (2021 fall-2022 spring) LinkedIn
Research Topic: Ferro device fabrication and modeling
First employment: Assistant professor, Gachon University, South Korea
4. Wonbo Shim, Postdoc (2019 summer-2021 summer) LinkedIn
Research Topic: NVM chip testing and NAND based deep learning architecture design
First employment: Assistant professor, Seoul National University of Science and Technology, South Korea
5. Jiyong Woo, Postdoc (2017 fall-2019 spring) LinkedIn
Research Topic: Resistive device fabrication and circuit-device interaction
First employment: Electronics and Telecommunications Research Institute (ETRI) of South Korea; (Now) Assistant professor, Kyungpook National University, South Korea
6. Ligang Gao, Postdoc (2014 fall-2017 summer) LinkedIn
Research Topic: Resistive device optimization and crossbar array fabrication
First Employment: Solar Junction (Tempe, AZ); (Now) Lam Research (Chandler, AZ)
1. Jack Sacane, MS (2020 fall-2021 spring) LinkedIn
MS Thesis: Total Ionizing Dose Effect on Deep Neural Networks Implemented with Multi-Level RRAM Arrays
First Employment: Millennium Space Systems (Los Angeles, CA)
2. Sho Ko, MS (2019 fall-2020 spring) LinkedIn
MS Thesis: Efficient Pipelined ReRAM-based Processing-in-Memory Architecture for Convolutional Neural Network Inference
First Employment: Continue PhD study at Stanford University
Undergraduate Students
1. Yiming Tan (2022 fall-present)
2. Ethan Weinstock, DOD SCALE fellow (2021 fall-2023 spring)
- Eta Kappa Nu (HKN) Society Outstanding Computer Engineering Senior Award 2023
- Opportunity Research Scholars’ Symposium Best Paper Award 2023
3. Laura Heller (2019 fall-2020 spring)
4. Jenna Moore, NSF REU and Honor’s thesis (2016 summer-2017 spring)
5. Ryan Madler, NSF REU and Honor’s thesis (2015 fall-2016 spring)
6. Scott Zuloaga (2014 summer-2015 spring)